Basic research advance leads to production of more than 250,000 chips embedded within fibers in less than a year.
by Zach Winn, MIT News
In the summer of 2018, a team led by MIT researchers reported in the journal Naturethat they had successfully embedded electronic devices into fibers that could be used in fabrics or composite products like clothing, airplane wings, or even wound dressings. The advance could allow fabrics or composites to sense their environment, communicate, store and convert energy, and more.
Research breakthroughs typically take years to make it into final products — if they reach that point at all. This particular research, however, is following a dramatically different path.
By the time the unique fiber advance was unveiled last summer, members of Advanced Functional Fabrics of America (AFFOA), a not-for-profit near MIT, had already developed ways to increase the throughput and overall reliability of the process. And, staff at Inman Mills in South Carolina had established a method to weave the advanced fibers using a conventional, industrial manufacturing-scale loom to create fabrics that can use light to both broadcast and receive information.
Today, less than a year after the technology was first introduced to the world, around a quarter of a million semiconducting devices have been embedded in fibers using the patented technology, and companies like New Balance, VF, Bose, and 3M are seeking ways to use the technology in their products.
The fabric of entrepreneurship and education
AFFOA has also partnered with schools such as the Fashion Institute of Technology in New York and the Greater Lawrence Technical School, where students are learning how to design and make an advanced chip-containing fibers, as well as other skills related to manufacturing advanced functional fabrics and the products that will emerge from them.
Additionally, over 30 entrepreneurs have been working on establishing startups around advanced fabrics as part of the advanced fabric entrepreneurship program managed by AFFOA in collaboration with the Venture Mentoring Service at MIT.
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